I don't mind them gluing things like the battery in since it make for a more rigid phone provided they use a glue that a moderate amount of heat can greatly weaken.
The problem with upgrading parts of something like a phone is that the components interfaces change frequently. Even desktop cpu/memory sockets change every few years.
Compact form factors are worse as you dont have room for the connector, and for the larger components they are like the engine in a F1 car, a important structural piece.
I do like the concept of Ara, but I don't think it will be practical anytime soon.
The problem with upgrading parts of something like a phone is that the components interfaces change frequently. Even desktop cpu/memory sockets change every few years.
Compact form factors are worse as you dont have room for the connector, and for the larger components they are like the engine in a F1 car, a important structural piece.
I do like the concept of Ara, but I don't think it will be practical anytime soon.